Journal: IEEE Electron Device Letters
Loading...
Abbreviation
IEEE Electron Device Lett.
Publisher
IEEE
57 results
Search Results
Publications 1 - 10 of 57
- InP/GaAsSb DHBTs With 500-GHz Maximum Oscillation FrequencyItem type: Journal Article
IEEE Electron Device LettersLövblom, Rickard; Flückiger, Ralf; Zeng, Yuping; et al. (2011) - Transistor heater for microhotplate-based metal-oxide microsensorsItem type: Journal Article
IEEE Electron Device LettersGraf, M.; Müller, S.K.; Barrettino, D.; et al. (2005) - Ab-Initio Simulation of van der Waals MoTe2–SnS2 Heterotunneling FETs for Low-Power ElectronicsItem type: Journal Article
IEEE Electron Device LettersSzabó, Áron; Koester, Steven J.; Luisier, Mathieu M. (2015) - Oxide Thin-Film Electronics on Carbon Fiber Reinforced Polymer CompositeItem type: Journal Article
IEEE Electron Device LettersMünzenrieder, Niko; Costa, Júlio; Cantarella, Giuseppe; et al. (2017) - 107-GHz (Al,Ga)N/GaN HEMTs on Silicon With Improved Maximum Oscillation FrequenciesItem type: Journal Article
IEEE Electron Device LettersTirelli, Stefano; Marti, Diego; Sun, Haifeng; et al. (2010) - 100-nm-Gate (Al,In)N/GaN HEMTs Grown on SiC With FT=144 GHzItem type: Journal Article
IEEE Electron Device LettersSun, Haifeng; Alt, Andreas R.; Benedickter, Hansruedi; et al. (2010)One-hundred-nanometer-gate (Al,In)N/GaN high-electron-mobility transistors (HEMTs) grown on semi-insulating SiC achieve a maximum current density of 1.84 A/mm at V GS = 0 V, an extrinsic transconductance of 480 mS/mm, and a peak current gain cutoff frequency as high as f T = 144 GHz, which is the highest so far reported for any (Al,In)N/GaN-based HEMT. This f T matches the best published values that we could find for 100-nm-gate (Al,Ga)N/GaN HEMTs, thus closing the cutoff frequency gap between (Al,In)N/GaN and (Al,Ga)N/GaN HEMTs. Additionally, similar devices grown on (111) high-resistivity silicon show a peak f T of 113 GHz, also setting a new performance benchmark for (Al,In)N/GaN HEMTs on silicon. Our findings indicate significant performance advantages for (Al,In)N/GaN HEMTs fabricated on SiC substrates. The improved performance for devices grown on SiC is derived from the superior transport properties of (Al,In)N/GaN 2DEGs grown on that substrate. - Band-to-Band Tunneling in SiGe: Influence of Alloy ScatteringItem type: Journal Article
IEEE Electron Device LettersJin, Seonghoon; Park, Hong-Hyun; Luisier, Mathieu; et al. (2017) - Submicrometer Copper T-Gate AlGaN/GaN HFETsItem type: Journal Article
IEEE Electron Device LettersSun, H. F.; Alt, Andreas R.; Bolognesi, Colombo R. (2007) - Emitter Size Effect in GaAsSb-Based DHBTs With AlInP and GaInP EmittersItem type: Journal Article
IEEE Electron Device LettersLövblom, Rickard; Flückiger, Ralf; Ostinelli, Olivier; et al. (2013) - Fully Passivated AlInN/GaN HEMTs With f(T)/f(MAX) of 205/220 GHzItem type: Journal Article
IEEE Electron Device LettersTirelli, S.; Marti, D.; Sun, Haifeng; et al. (2011)
Publications 1 - 10 of 57