Journal: Materials Science Forum

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Abbreviation

Publisher

Trans Tech Publications

Journal Volumes

ISSN

0255-5476
1662-9752

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Publications 1 - 10 of 62
  • Pogatscher, Stefan; Werinos, Marion; Antrekowitsch, Helmut; et al. (2014)
    Materials Science Forum
  • Woerle, Judith; Prokscha, Thomas; Grossner, Ulrike (2020)
    Materials Science Forum
    In this work, the potential of muon spin rotation (μSR) with low-energy muons (LE-μ) for the investigation of oxidation-induced defects at the SiO2/4H-SiC interface is explored. By using implantation energies for the muons in the keV range and comparing the fractions of muonium in different regions, the depth distribution of defects in the first 200 nm of the target material can be resolved. Defect profiles of interfaces with either deposited or thermally grown SiO2 layers on 4H-SiC are compared. The results show an increased number of defects in the case of a thermal oxide, both on the oxide and on the SiC side of the interface, with a spatial extension of a few tens of nm.
  • Fischer, P.; Züttel, Andreas (2004)
    Materials Science Forum
  • (2023)
    Materials Science Forum
  • Crivelli, Paolo; Gendotti, Ulisse; Rubbia, André; et al. (2009)
    Materials Science Forum ~ Positron and positronium chemistry: proceedings of the 9th international workshop on Positron and Positronium Chemistry, May 11-15, 2008, Wuhan University, China
  • Müting, Johanna; Bobal, Viktor; Azarov, Alexander; et al. (2019)
    Materials Science Forum ~ Silicon Carbide and Related Materials 2018
  • Camarda, Massimo; Woerle, Judith; Soulière, Veronique; et al. (2017)
    Materials Science Forum
    In this study, we compare the electrical properties of MOS capacitors fabricated on different surface morphologies. Comparing a standard, low-roughness (<1nm), surface with one with a roughness of ~40nm, characterized by big macrosteps and large terraces. We compared the two surfaces for different thermal oxide thicknesses, ranging from dOx = 3.6 nm to dOx = 32 nm. The extracted interface state traps (Dit) shows a small, but systematic, decrease of ~10-15 % for the samples with macrosteps.
  • Nipoti, Roberta; Parisini, Antonella; Carnera, Alberto; et al. (2015)
    Materials Science Forum ~ Silicon Carbide and Related Materials 2014
  • Nipoti, Roberta; Parisini, Antonella; Vantaggio, Salvatore; et al. (2016)
    Materials Science Forum ~ Silicon Carbide and Related Materials 2015
    This study shows that, after annealing at 1950°C, a 1×1020 cm-3 Al+ implanted 4H-SiC material shows a decreasing resistivity with increasing annealing time in the range 5-25 min. After this, the resistivity remains constant up to an annealing time of 40 min. The estimated minimum time to gain the thermal equilibrium in this implanted material at 1950°C is 12 min. Electrical characterization has been performed in the 20-680 K temperature range.
  • Löffler, Jörg F.; Wagner, W.; Swygenhoven, H. van (1996)
    Materials Science Forum
Publications 1 - 10 of 62