Journal: IEEE Microwave Magazine

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Abbreviation

Publisher

IEEE

Journal Volumes

ISSN

1527-3342
1557-9581

Description

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Publications 1 - 10 of 10
  • Wang, Hua; Kousai, Shouhei; Onizuka, Kohei; et al. (2015)
    IEEE Microwave Magazine
    The ever-growing demand for higher data rates, power efficiency, and robust operations poses increasingly stringent performance requirements on wireless transceiver systems. This is particularly critical for mobile devices in both commercial and defense applications, where improving system size, weight, and power metrics and extending the battery lifetime are often the primary concerns. The power amplifier (PA) serves as the interface between the RF transmitter system and the antenna and is often considered one of the most critical building blocks in a wireless transceiver. This is because the PA's performance has critical impacts on multiple major transmitter metrics, including the output power level, power efficiency, bandwidth, and signal fidelity, and therefore governs the overall quality of service (QoS) of the wireless link [1], [2]. Moreover, due to their large-signal and high-power operations at RF frequencies, PAs often encounter unique design challenges and tradeoffs that deserve special attention [3].
  • Chiao, J.-C.; Shanaa, Osama; Mortazawi, Amir; et al. (2018)
    IEEE Microwave Magazine
    Presents information on Microwave Week 2018.
  • The 2023 RFIC Symposium
    Item type: Other Journal Item
    Lie, Donald Y.C.; Manstretta, Danilo; Wang, Hua (2023)
    IEEE Microwave Magazine
    Lists future events that should be of interest to practitioners and researchers.
  • Iezekiel, Stavros; Burla, Maurizio; Klamkin, Jonathan; et al. (2015)
    IEEE Microwave Magazine
  • Ferrero, A.; Teppati, V.; Fledell, E.; et al. (2011)
    IEEE Microwave Magazine
  • Choudhury, Debabani; Wang, Hua; Li, Jenshan (2021)
    IEEE Microwave Magazine
    Describes the above-named upcoming conference event. May include topics to be covered or calls for papers.
  • Shakya, Dipankar; Rappaport, Theodore S.; Shahrjerdi, Davood; et al. (2024)
    IEEE Microwave Magazine
    A new multiuser terahertz (THz) measurement facility, or 'THz Lab,' located at the New York University (NYU) wireless research center, develops a next-generation laboratory to enable pioneering research at the upper reaches of the radio spectrum: the sub-THz (100-300 GHz) and THz (0.3-3 THz) frequency bands. The cellular telephone industry's recent realization of the viability of the millimeter wave (mm-wave) radio spectrum for 5G has created a need for the next-generation measurement platform that can promote foundational research for wireless communications, circuit design, antennas and propagation, and novel materials into the 6G era and beyond [1]. The THz Lab, funded by a US$3 million National Science Foundation (NSF): Major Research Instrumentation (MRI) grant, explores the spectrum frontier at frequencies from the mm-wave and into the THz bands, where material and propagation properties are not well known but which offer great promise for massively wideband channels and yet-to-be-determined capabilities of future cell phones, autonomous vehicles, and smart devices. Since the U.S. Federal Communications Commission authorized using sub-THz frequencies above 95 GHz for the first time in 2019 [2], other countries are also now opening these high-frequency bands. Notably, Ofcom in the United Kingdom and other European nations through the European Union's Horizon 2020 have begun exploring spectrum sharing and device innovations for applications at the THz frequencies [3], [4]. Similarly, spectrum regulators in Canada and Australia are actively exploring applications and use cases at sub-THz and THz frequencies [5], [6]. The costs and technical challenges to accurately design and repeatably measure devices and radio systems at these frequencies are tremendous. However, little is known about how to best design such systems, let alone characterize them and make them work reliably. The THz Lab enables fundamental explorations of circuits, antennas, radio propagation, and materials at the THz level for applications involving sensing and communications in emerging 6G wireless networks and beyond.
  • Taking a Look Beneath the Surface
    Item type: Journal Article
    Grathwohl, Alexander; Stelzig, Michael; Kanz, Julian; et al. (2022)
    IEEE Microwave Magazine
  • Chu, Chenhao; Dhar, Sagar K.; Zhou, Xinyu (2023)
    IEEE Microwave Magazine
    The 18th High-Efficiency Power Amplifier (HEPA) Student Design Competition (SDC) took place at the 2022 IEEE International Microwave Symposium (IMS), on 21 June 2022. The competition was held by the IEEE Microwave Theory and Technology Society (MTT-S) Microwave High-Power Techniques Committee (MTT-12) in collaboration with Keysight Technologies. This year’s event was held in person after two years of virtual competitions (the 16th and 17th HEPA SDCs) during the COVID-19 pandemic. IEEE Young Professionals (YPs) from all the around the world gathered in Denver, CO, USA, to participate in the competition and discuss their experience in the design of HEPAs.
  • Wang, Hua (2013)
    IEEE Microwave Magazine
    There is an ever-increasing yet unmet market demand for high-performance biosensors that can reliably interface with the biological entities under test and accurately interpret the microscopic biochemical processes by readily measurable signals. These sensors will provide radical solutions to future medical diagnosis applications. Such sensors need to provide high sensitivity, large dynamic range, and handheld portability all within a low price tag to be qualified as functionally and economically viable products. Once fully developed, they can serve as a portable molecular level medical diagnostic platform to address applications such as low-cost home health care, epidemic disease control, bio-threat detection, and environmental monitoring [1], [2]. In parallel, complementary metal-oxide-semiconductor (CMOS), as one of the most mature integrated circuit (IC) processes, has gained increased attention among the biosensors and bioelectronics community. The modern CMOS process provides high-performance signal receiving and generation, unparalleled on-chip computation, and low cost at a mass-production level. As a result, CMOS ICs naturally offer a powerful, versatile, and cost competitive platform for implementing integrated biosensors.
Publications 1 - 10 of 10