Hua Wang


Last Name

Wang

First Name

Hua

ORCID

0000-0003-4952-5505

Organisational unit

09757 - Wang, Hua / Wang, Hua

Search Results

Publications 1 - 10 of 286
  • Session 11 — Advanced techniques for power amplifier transceiver front-ends
    Item type: Other Conference Item
    Wang, Yanjie; Wang, Hua (2015)
    2015 IEEE Custom Integrated Circuits Conference (CICC)
  • A CMOS broadband power amplifier with a transformer-based high-order output matching network
    Item type: Journal Article
    Wang, Hua; Sideris, Constantine; Hajimiri, Ali (2010)
    IEEE Journal of Solid-State Circuits
    A transformer-based high-order output matching network is proposed for broadband power amplifier design, which provides optimum load impedance for maximum output power within a wide operating frequency range. A design methodology to convert a canonical bandpass network to the proposed matching configuration is also presented in detail. As a design example, a push-pull deep class-AB PA is implemented with a third-order output network in a standard 90 nm CMOS process. The leakage inductances of the on-chip 2:1 transformer are absorbed into the output matching to realize the third-order network with only two inductor footprints for area conservation. The amplifier achieves a 3 dB bandwidth from 5.2 to 13 GHz with 25.2 dBm peak and 21.6% peak PAE. The EVM for QPSK and 16-QAM signals both with 5 Msample/s are below 3.6% and 5.9% at the output 1 dB compression point. This verifies the PA's capability of amplifying a narrowband modulated signal whose center-tone can be programmed across a large frequency range. The measured BER for transmitting a truly broadband PRBS signal up to 7.5 Gb/s is less than 10 , demonstrating the PA's support for an instantaneous wide operation bandwidth.
  • A 23-37-GHz Autonomous 2D MIMO Receiver Array with Rapid Full-FoV Spatial Filtering for Unknown Interference Suppression
    Item type: Journal Article
    Huang, Tzu-Yuan; Lin, Boce; Ahmed, Amr; et al. (2023)
    IEEE Transactions on Microwave Theory and Techniques
    Millimeter-wave (mm-Wave) receiver (RX) array systems are widely employed to address a plethora of applications for telecommunication, radar sensing, localization, imaging, and weather monitoring. Many future mm-Wave arrays need to operate in increasingly dynamic and mobile scenarios with complicated electromagnetic (EM) environments. With their wide deployment, they are more likely to be exposed to strong interferences with unknown angle-of-arrival (AoA), frequency, and modulation schemes. In this work, we propose and implement a 23–37-GHz autonomous 2-D multiple-input and multiple-output (MIMO) RX array system with rapid full field-of-view (FoV) spatial filtering and beamforming to manage interferences and signals from unknown direction-of-arrival (DoA). The implemented RX array system architecture provides multiple deep spatial notches to relax the dynamic range requirement of downstream analog-to-digital converter (ADC) circuits and is also extendable to a larger 2-D array. The implemented RX array system includes a broadband mm-Wave frontend and two autonomous spatial filter stages (ASFs) in cascade without losing MIMO capability. A prototype is demonstrated in a 45-nm RF CMOS silicon on insulator (SOI) process. The broadband mm-Wave frontend achieves $S_{11}$ $<$ $-$ 10 dB from 26 to 36 GHz with 23–37-GHz 3-dB bandwidth and 4.9-dB minimum noise figure (NF) within the operating band. Our autonomous MIMO array demonstrates $>-$ 2.4 dB normalized array factor over full FoV and spatial notch with $>$ 27.1 dB cancellation. With two ASFs stages in cascade, we demonstrate two individual spatial notches, each with $>$ 28.3 dB spatial cancellation on unknown blockers. Furthermore, co-channel wideband modulated blockers are autonomously rejected, and the desired signal is successfully demodulated for 2.4-Gb/s 64 QAM (highest speed) with $-$ 22.02-dB error vector magnitude (EVM) rms (25% interference/signal co-channel overlap), for 0.6-Gb/s 64 QAM with $-$ 26.32-dB EVMrms (50% co-channel overlap) and for 1.2-Gb/s 64 QAM with $-$ 26.16-dB EVMrms (25% co-channel overlap).
  • An Ultra-Compact Wideband Load-Insensitive Complex-Cascode LC-Neutralized Power Amplifier for 4:1 VSWR-Resilient Operations in Large-Scale Phased-Arrays
    Item type: Other Conference Item
    Eleraky, Mohamed; Huang, Tzu-Yuan; Wang, Hua (2025)
    2025 IEEE International Solid-State Circuits Conference (ISSCC)
    Large-scale mm-wave phased arrays are crucial for the success of next-generation 5G/6G communication. Yet, using a dense array of antennas inevitably leads to mutual coupling between nearby antennas, causing antenna impedance variations that depend on frequency, scanning angle (θ)and antenna location, resulting in a high Voltage Standing-Wave Ratio (VSWR). Wideband arrays with large scanning angles >±60°, such as arrays for airborne platforms, exhibit an exacerbated 4:1 antenna VSWR. This imposes challenges for the power-amplifier (PA) design, affecting OP1dB, power-gain (PG) flatness, and efficiency. Further, the PA PG and output phase are affected by the antenna VSWR. Consequently, these aspects substantially complicate the array calibration and degrade the phased array performance at large scanning angles. Figure 5.5.1 (top) shows the simulated PG of a common source PA under varying load conditions imposed by the active S11 of a 4x4 patch antenna array. With θ ranging from 0° to 60° and frequency shifts of ±5%, the resulting VSWR > 4:1, leading to a PG variation of over 7dB.
  • Analysis and Design of Differential Complex Neutralization Power Amplifiers for Efficient-Yet-Linear High Mm-Wave Applications
    Item type: Conference Paper
    Eleraky, Mohamed; Huang, Tzu-Yuan; Liu, Yuqi; et al. (2024)
    2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
    This paper presents a systematic design and optimization methodology to enhance the power gain of a given device towards its theoretically maximum stable power gain 4U, U as the Mason's Unilateral power gain, over a wide bandwidth. A device-level Gain-Bandwidth product (GBW) metric is also defined to assess high mm-Wave device gain boosting. The proposed technique exploits a high-order complex neutralization embedding network on a differential power device pair. For proof-of-concept, a D-band 3-stage PA with two-way power combining is implemented in GlobalFoundries 45 nm SOI process. The measurements show a peak power gain of 21.7 dB with a 3-dB BW of 15 GHz (117-132 GHz) in a compact area of 0.116 mm(2). The wideband device gain enhancement allows the PA to operate in class-AB biasing, achieving efficient-yet-linear operations at 127.5 GHz with P-sat and OP1dB of 11.9 and 11.85 dBm respectively and a peak PAE of 15%.
  • A Mm-Wave Phase-Time Co-Apertured Transceiver Array with Beam Squinting Mitigation for Wideband Beamforming/Spatial-Nulling
    Item type: Other Conference Item
    Eleraky, Mohamed; Park, Jeongsoo; Abdelmagid, Basem Abdelaziz; et al. (2024)
    2024 IEEE Custom Integrated Circuits Conference (CICC)
  • Microwave Resonant Plasmonic Modulator for Sub-THz Receivers
    Item type: Other Conference Item
    Vukovic, Boris; Moor, David; Fedoryshyn, Yuriy; et al. (2024)
    Technical Digest Series ~ CLEO 2024
    A coplanar-waveguide-based resonator is used to enhance plasmonic modulators at 250 GHz by 5 dB with a bandwidth of 44 GHz. This impedance matching is a compact, low-complexity solution to enhance the efficiency at high modulation frequencies for sub-THz wireless communication.
  • A 4-Channel Beamformer for 9-Gb/s MMW 5G Fixed-Wireless Access Over 25-km SMF with Bit-Loading OFDM
    Item type: Conference Paper
    Tang, Yu; Huang, Min-Yu; Chen, You-Wei; et al. (2019)
    OSA Technical Digest ~ Optical Fiber Communications Conference and Exhibition (OFC 2019)
    An MMW 5G-FWA system is experimentally demonstrated with bit-loading OFDM and a 4-channel beamforming receiver. 9 Gb/s data rate is achieved after 25-km transmission with similar BER performance of 0o and 60o incident angles.
  • Live demonstration: A 1024-pixel CMOS multi-modality sensing array for cell-based assays
    Item type: Other Conference Item
    Park, Jong Seok; Aziz, Moez Karim; Chi, Taiyun; et al. (2016)
    2016 IEEE Sensors
    Summary form only given. We propose to exhibit a live demonstration of a CMOS multi-modality cellular biosensor array chip that can facilitate drug screening and cell-based assays. The multi-modality sensing functionality enables real-time measurements of multiple physiological parameters of biological cells and cell clusters, such as their electric potential, impedance, optical opacity, and bioluminescent imaging. Compared with existing single-modality sensors, our multi-modality sensor captures multi-physics cellular responses with a high spatiotemporal resolution, substantially expanding our capabilities of monitoring cellular states and understanding complex drug mechanistic effects. For our live demonstration, we will operate our CMOS sensor chip with testing samples to present its multi-modality sensing capability and clinical relevance.
  • Antenna-in-Package, Antenna-on-Chip, Antenna-IC Interface: Joint Design and Cointegration
    Item type: Other Journal Item
    Hong, Wonbin; Maaskant, Rob; Liu, Duixian; et al. (2019)
    IEEE Antennas and Wireless Propagation Letters
    The twenty peer-reviewed letters in this special section examine the design and cointegration of antenna-in-package (AiP), antenna-on-chip (AoC), and antenna ICs (AIC). The letters are categorized in the four distinctive categories: 1) Fabrication technologies (four); 2) Measurement strategies; 3) Applications; and 4) New design and integration strategies. Fruition of major thrusts such as 5G/6G, high-resolution radar and imaging, autonomous driving, and space technology are highly intertwined with the advance of applied electromagnetics. Miniaturization and seamless integration of microwave components and radio systems can enable superior performance, form factor, and cost efficiencies leading to enhanced proliferation of such applications. Historically, radio frequency front ends, antennas, and microwave components have separately evolved using distinct fabrication and measurement technologies.
Publications 1 - 10 of 286