Multiscale simulation of aluminum thin films for the design of highly-reliable MEMS devices
METADATA ONLY
Loading...
Author / Producer
Date
2009
Publication Type
Conference Paper
ETH Bibliography
yes
Citations
Altmetric
METADATA ONLY
Data
Rights / License
Abstract
A multiscale simulation methodology is presented to predict the macroscopic mechanical properties of aluminum thin films with a columnar grain structure from the morphology at microscopic scale. The elasto–plastic characteristics of the thin films are calculated as a function of the grain size, temperature, and strain rate by taking into account creep phenomena. The simulated data are validated by experimental stress–strain curves measured by dedicated microstructures in conjunction with a nanoindentation test equipment.
Permanent link
Publication status
published
Editor
Book title
Journal / series
Volume
49 (9-11)
Pages / Article No.
1278 - 1282
Publisher
Elsevier
Event
20th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2009)