SiC power semiconductors in HEVs
Influence of junction temperature on power density, chip utilization and efficiency
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Author / Producer
Date
2009
Publication Type
Conference Paper
ETH Bibliography
yes
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Rights / License
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Publication status
published
External links
Editor
Book title
2009 35th Annual Conference of IEEE Industrial Electronics
Journal / series
Volume
Pages / Article No.
3834 - 3841
Publisher
IEEE
Event
35th Annual Conference of the IEEE Industrial Electronics Society (IECON 2009)
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Organisational unit
03889 - Biela, Jürgen / Biela, Jürgen