From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films
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Author / Producer
Date
2015
Publication Type
Journal Article
ETH Bibliography
yes
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Publication status
published
External links
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Book title
Journal / series
Volume
99
Pages / Article No.
213 - 227
Publisher
Elsevier
Event
Edition / version
Methods
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Date collected
Date created
Subject
Phase separation; Interconnected percolating metallic networks; Refractory solid solution; Thermally activated processes; Tungsten–copper microstructure evolution
Organisational unit
03692 - Spolenak, Ralph / Spolenak, Ralph