Acceleration Of The Curing Process Of A Paste Adhesive For Aerospace Applications Considering Cure Dependent Void Formations
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Author / Producer
Date
2014
Publication Type
Journal Article
ETH Bibliography
yes
Citations
Altmetric
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Data
Rights / License
Permanent link
Publication status
published
Editor
Book title
Journal / series
Volume
48
Pages / Article No.
51 - 58
Publisher
Elsevier
Event
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Epoxy paste adhesive; Curing process; Induction heating; Void formation
Organisational unit
03507 - Ermanni, Paolo (emeritus) / Ermanni, Paolo (emeritus)
Notes
Accepted 16 July 2013, Published online 27 September 2013.