System design using high density packaging and multi chipmodules
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Author / Producer
Date
2000
Publication Type
Doctoral Thesis
ETH Bibliography
yes
Citations
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Data
Rights / License
Permanent link
Publication status
published
External links
Editor
Contributors
Examiner : Tröster, Gerhard
Book title
Journal / series
Volume
Pages / Article No.
Publisher
ETH Zürich
Event
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
MULTICHIP MODULE, MCM (MIKROELEKTRONIK); GEHÄUSE/MIKROELEKTRONIK; MIKROVERBINDUNGEN + DRAHTBONDVERBINDUNGEN (MIKROELEKTRONIK); FLIP-CHIP-TECHNIK + FLIP-CHIP-MONTAGE (MIKROELEKTRONIK); MULTICHIP MODULES, MCM (MICROELECTRONICS); PACKAGING TECHNOLOGY (MICROELECTRONICS); BONDING (MICROELECTRONICS); FLIP CHIP TECHNOLOGY + FLIP CHIP ASSEMBLY (MICROELECTRONICS)
Organisational unit
03388 - Tröster, Gerhard (emeritus)
Notes
Diss. Technische Wissenschaften ETH Zürich, Nr. 13604, 2000.