Plasma Polymerization of Acrylic Acid Revisited


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Date

2009

Publication Type

Journal Article

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Abstract

To perform a systematic study over a broad parameter range of acrylic acid discharges, we varied the energy input W/F over a wide range. Five different regimes could be identified (from low to high energy input): regime I, where oligomerization takes place; regime II, the radical‐dominated plasma polymerization of acrylic acid; regime III, a transition regime showing etching/oxidation effects; regime IV, where the plasma polymerization resembles the one observed for CO₂/C₂H₄ discharges; and regime V, where etching effects yield a reduction in deposition rate. These results show that the polymerization mechanism can be described as a function of the energy input W/F. Specifically, a parameter range where acrylic acid can be replaced by CO₂/C₂H₄ discharges has been identified.

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published

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Volume

6 (4)

Pages / Article No.

246 - 254

Publisher

Wiley

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Subject

Acrylic acid; Deposition rate; Plasma polymerization; Processing parameter; RF plasma

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