Local creep in SnAg3.8Cu0.7 lead-free solder
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Author / Producer
Date
2005-09
Publication Type
Journal Article
ETH Bibliography
yes
Citations
Altmetric
METADATA ONLY
Data
Rights / License
Permanent link
Publication status
published
External links
Editor
Book title
Journal / series
Volume
34 (9)
Pages / Article No.
1206 - 1214
Publisher
Springer
Event
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Lead-free solder; Creep; Shear test; Microstructure; Focused ion beam (FIB)
Organisational unit
03661 - Löffler, Jörg F. / Löffler, Jörg F.
Notes
Received 1 October 2004, Accepted 25 January 2005.