AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+


METADATA ONLY
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Date

2025

Publication Type

Conference Paper

ETH Bibliography

yes

Citations

Altmetric
METADATA ONLY

Data

Rights / License

Publication status

accepted

External links

Editor

Book title

Journal / series

Volume

Pages / Article No.

Publisher

IEEE

Event

IEEE MTT-S International Microwave Symposium (IMS 2025)

Edition / version

Methods

Software

Geographic location

Date collected

Date created

Subject

Organisational unit

09757 - Wang, Hua / Wang, Hua check_circle

Notes

Conference lecture on June 19, 2025

Funding

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