A study of creep in polysilicon MEMS devices
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Author / Producer
Date
2005-01
Publication Type
Journal Article
ETH Bibliography
yes
Citations
Altmetric
METADATA ONLY
Data
Rights / License
Permanent link
Publication status
published
External links
Editor
Book title
Journal / series
Volume
127 (1)
Pages / Article No.
90 - 96
Publisher
American Society of Mechanical Engineers
Event
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
polysilicon material properties; creep measurements; high temperature; plastic deformation
Organisational unit
03609 - Hierold, Christofer / Hierold, Christofer
Notes
Manuscript received 27 January 2004, Revision received 23 June 2004.