Computationally Efficient Integration of Complex Thermal Multi-Chip Power Module Models into Circuit Simulators
METADATA ONLY
Loading...
Author / Producer
Date
2007
Publication Type
Conference Paper
ETH Bibliography
yes
Citations
Altmetric
METADATA ONLY
Data
Rights / License
Abstract
For analyzing reliability or short-term overload conditions of power electronic systems, it is necessary to know transient temperatures of the power semiconductors. Directly coupling thermal and circuit simulators increases the simulation time by orders of magnitude, therefore making such an approach impractical. A well-known solution to this problem is to extract thermal equivalent circuits from 3D-field simulations and to insert them directly into the circuit simulator. In this paper we discuss the poor scaling performance of this state-of-the-art approach. There is an enormous increase in simulation time if there are more than just a few chips thermally modeled. We propose a general procedure at the circuit simulator solver level to increase the calculation speed of such a coupled simulation significantly.
Permanent link
Publication status
published
External links
Editor
Book title
2007 Power Conversion Conference Proceedings
Journal / series
Volume
Pages / Article No.
550 - 557
Publisher
IEEE
Event
4th Power Conversion Conference (PCC'07)
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Electric-thermal simulation; Increasing simulation speed; Thermal coupling
Organisational unit
03573 - Kolar, Johann W. (emeritus) / Kolar, Johann W. (emeritus)