Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
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Author / Producer
Date
2019-10
Publication Type
Journal Article
ETH Bibliography
yes
Citations
Altmetric
METADATA ONLY
Data
Rights / License
Permanent link
Publication status
published
External links
Editor
Book title
Journal / series
Volume
48 (10)
Pages / Article No.
6823 - 6834
Publisher
Springer
Event
Edition / version
Methods
Software
Geographic location
Date collected
Date created
Subject
Sintering; copper nanoparticles; copper paste; die attachment; power electronic packaging; power electronics
Organisational unit
03831 - Studart, André R. / Studart, André R.