3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs
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Date
2024
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Conference Paper
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Abstract
This paper presents an investigation of System-onChip (SoC) communication latency optimization for 3D system integration and highlights the role of architectural modifications to maximize the Power, Performance, & Area (PPA) benefits. An instance of a highly configurable RISC-V SoC is implemented using similar to 2nm nanosheet technology and different 3D stacking options using design flow from sign-off tools. The proposed implementation targets performance optimization for different 3D partitioning scenarios: Memory-on-Logic (MoL) & Logicon-Logic (LoL). We target 2-die 3D Integrated Circuits (3DIC) with high density 3D interconnect using Face-to-Face (F2F) hybrid bonding (similar to 1 mu m), and 3-die stack, as Face-to-Back (F2B) on top of F2F. Our analysis of the 16-core SoC instance shows that the proposed architectural optimizations bring a significant reduction of 4 pipeline stages in the design hierarchy at a marginal cost of 9% effective frequency loss when implemented in 3D in comparison to the baseline 2D architecture. Further, going from 2D to 3D allows more than 40% total system wire-length reduction & 10% less cell area, resulting in 20% power savings. These findings hold promise for further explorations on manycore SoC instances (256 & more) facing system interconnect challenges.
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published
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2024 IEEE International Symposium on Circuits and Systems (ISCAS)
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Pages / Article No.
Publisher
IEEE
Event
IEEE International Symposium on Circuits and Systems (ISCAS 2024)
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Software
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Subject
STCO; 3D-IC; system architecture; interconnect architecture; 3D partitioning; logic-on-logic; memory-on-logic
Organisational unit
03996 - Benini, Luca / Benini, Luca