Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
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Author / Producer
Date
2006-06
Publication Type
Journal Article
ETH Bibliography
yes
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Publication status
published
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Journal / series
Volume
88 (23)
Pages / Article No.
233515
Publisher
American Institute of Physics
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Edition / version
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Date collected
Date created
Subject
Copper; X-ray diffraction; Voids (solid); Plasticity; Bending; Dislocations; Plastic flow; Point defects; Integrated circuit interconnections
Organisational unit
03692 - Spolenak, Ralph / Spolenak, Ralph
Notes
Received 1 February 2006, Accepted 10 May 2006, Published online 9 June 2006.