Multi-domain simulation of transient junction temperatures and resulting stress-strain behavior of power switches for long-term mission profiles
- Conference Paper
For lifetime estimation of power converters in traction applications, one method is to calculate numerically the stress-strain hysteresis curves of the interfaces silicon-solder-DCB and/or DCB-solder-baseplate inside the power modules. This can only be achieved if the transient junction temperatures in these layers are known for a defined mission-profile. Therefore, one has to couple circuit simulation with thermal simulation and stress-strain computation. The second challenge of this problem is to perform this transient simulation taking into account switching losses in the mus-range for mission profiles over a couple of minutes. In this paper we employ a new multi-domain simulation software to achieve results with reasonable computational effort. Show more
Book title2008 IEEE 11th Workshop on Control and Modeling for Power Electronics
Pages / Article No.
Organisational unit03573 - Kolar, Johann W. / Kolar, Johann W.
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