Development of a Reliable Packaging for CMOS-based Microelectrode Arrays by Using an Automated Setup

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Author
Stettler, Alexander
Buchmann, Peter
Rothe, Jörg
Radivojevic, Milos
Hierlemann, Andreas
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Date
2014
Type
  • Conference Paper
Publication status
published
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Journal / series
Procedia Engineering
Volume
87
Pages / Article No.
1402 - 1405
Publisher
Elsevier BV
Event
28th European Conference on Solid-State Transducers (EUROSENSORS 2014), Brescia, Italy, September 7-10, 2014
Subject
CMOS; MEMS; MEA; Microelectrode arrays; Packaging; Encapsulation
Organisational unit
03684 - Hierlemann, Andreas / Hierlemann, Andreas  
Notes
Published online 31 December 2014.
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Cited 1 times in Web of Science
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