Thermal Analysis and Interpolation Techniques for a Logic plus WideIO Stacked DRAM Test Chip

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Author
Beneventi, Francesco
Bartolini, Andrea
Vivet, Pascal
Benini, Luca
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Date
2016-04
Type
  • Journal Article
Publication status
published
External links
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Journal / series
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume
35(4)
Pages / Article No.
623 - 636
Publisher
IEEE
Subject
3-D integration; 3D Integration; Sensor Virtualization; Temperature estimation; Temperature sensor; Thermal interpolation; Radial basis function (RBF)
Organisational unit
03996 - Benini, Luca  
Notes
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Citations
Cited 3 times in Web of Science
ETH Bibliography
yes
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