Thermal Analysis and Interpolation Techniques for a Logic plus WideIO Stacked DRAM Test Chip

Open access
Date
2016-04Type
- Journal Article
Citations
Cited 9 times in
Web of Science
Cited 11 times in
Scopus
ETH Bibliography
yes
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Permanent link
https://doi.org/10.3929/ethz-b-000115001Publication status
publishedExternal links
Journal / series
IEEE Transactions on Computer-Aided Design of Integrated Circuits and SystemsVolume
Pages / Article No.
Publisher
IEEESubject
3-D integration; 3D Integration; Sensor Virtualization; Temperature estimation; Temperature sensor; Thermal interpolation; Radial basis function (RBF)Organisational unit
03996 - Benini, Luca / Benini, Luca
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Citations
Cited 9 times in
Web of Science
Cited 11 times in
Scopus
ETH Bibliography
yes
Altmetrics