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dc.contributor.author
Alloatti, Luca
dc.contributor.author
Ram, Rajeev Jagga
dc.date.accessioned
2019-09-18T12:06:21Z
dc.date.available
2017-06-12T12:06:23Z
dc.date.available
2019-09-18T12:06:21Z
dc.date.issued
2016-08-25
dc.identifier.issn
2158-3226
dc.identifier.other
10.1063/1.4961949
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/120170
dc.identifier.doi
10.3929/ethz-b-000120170
dc.description.abstract
We report on vertically-illuminated photodiodes fabricated in the GlobalFoundries 45nm 12SOI node and on a packaging concept for optically-interconnected chips. The photodiodes are responsive at 1180 nm –a wavelength currently used in chip-to-chip communications. They have further a wide field-of-view which enables chip-to-board positional feedback in chip-board assemblies. Monolithic integration enables on-chip processing of the positional data.
en_US
dc.format
application/pdf
en_US
dc.language.iso
en
en_US
dc.publisher
American Institute of Physics
en_US
dc.rights.uri
http://creativecommons.org/licenses/by/4.0/
dc.title
Infrared vertically-illuminated photodiode for chip alignment feedback
en_US
dc.type
Journal Article
dc.rights.license
Creative Commons Attribution 4.0 International
ethz.journal.title
AIP Advances
ethz.journal.volume
6
en_US
ethz.journal.issue
8
en_US
ethz.pages.start
085219
en_US
ethz.size
7 p.
en_US
ethz.version.deposit
publishedVersion
en_US
ethz.identifier.wos
ethz.identifier.scopus
ethz.identifier.nebis
006233320
ethz.publication.place
Melville, NY
en_US
ethz.publication.status
published
en_US
ethz.date.deposited
2017-06-12T12:07:02Z
ethz.source
ECIT
ethz.identifier.importid
imp593654af99fb843549
ethz.ecitpid
pub:182223
ethz.eth
yes
en_US
ethz.availability
Open access
en_US
ethz.rosetta.installDate
2017-07-20T15:28:34Z
ethz.rosetta.lastUpdated
2019-09-18T12:06:39Z
ethz.rosetta.versionExported
true
ethz.COinS
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