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dc.contributor.author
Castellazzi, Alberto
dc.contributor.author
Ciappa, Mauro
dc.date.accessioned
2020-09-24T11:55:31Z
dc.date.available
2017-06-08T21:30:48Z
dc.date.available
2020-09-24T11:55:31Z
dc.date.issued
2008
dc.identifier.isbn
978-1-4244-2550-1
en_US
dc.identifier.isbn
978-1-4244-2551-8
en_US
dc.identifier.other
10.1109/COMPEL.2008.4634675
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/14834
dc.description.abstract
This paper explores a coupled electro-thermal modeling approach based on the integration of analytical compact models of semiconductor physics with a distributed three-dimensional description of thermal phenomena. The main motivation for the development of novel approaches resides in the increasing integration level of power components and equipment, which is pushing the validity of essentially-1D compact thermal models (i.e., RC-Networks) to their limit. Distinctive features of the proposed solution are great flexibility as regards the level of detail that needs to be considered (chip, substrate, heat-sink; 2D or 3D) and the suitability to describe diverse aspect-ratios and shapes. The resulting models are apt for use in general purpose circuit simulators (e.g., Saber, Simplorer) and to be coupled with realistic control and drive signals, enabling a more accurate and in-depth characterization of assembled devices.
en_US
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.title
Multi-level electro-thermal modeling for circuit simulation of packaged power devices
en_US
dc.type
Conference Paper
dc.date.published
2008-09-26
ethz.book.title
2008 IEEE 11th Workshop on Control and Modeling for Power Electronics
en_US
ethz.pages.start
93
en_US
ethz.pages.end
98
en_US
ethz.event
11th IEEE Workshop on Control and Modeling for Power Electronics (COMPEL 2008)
en_US
ethz.event.location
Zurich, Switzerland
en_US
ethz.event.date
August 17-20, 2008
en_US
ethz.publication.place
Piscataway, NJ
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
03228 - Fichtner, Wolfgang
en_US
ethz.leitzahl.certified
03228 - Fichtner, Wolfgang
ethz.date.deposited
2017-06-08T21:30:56Z
ethz.source
ECIT
ethz.identifier.importid
imp59364c4675e4385398
ethz.ecitpid
pub:26526
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2017-07-18T10:14:35Z
ethz.rosetta.lastUpdated
2021-02-15T17:30:41Z
ethz.rosetta.versionExported
true
ethz.COinS
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