3D Integration of Power Semiconductor Devices based on Surface Bump Technology

Metadata only

Author

Date

2008

Type

Conference Paper

ETH Bibliography

yes

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Publication status

published

External links

Book title

CIPS 2008. 5th International Conference on Integrated Power Electronics Systems

Journal / series

ETG-Fachbericht

Volume

111

Pages / Article No.

127 - 132

Publisher

VDE-Verlag

Event

5th International Conference on Integrated Power Electronics Systems, March 11-13, 2008

Organisational unit

03228 - Fichtner, Wolfgang

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ETH Bibliography

yes

Altmetrics

Research Collection