3D Integration of Power Semiconductor Devices based on Surface Bump Technology

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Author
Mermet-Guyennet, Michel
Castellazzi, Alberto
Lasserre, Philippe
Saiz, José
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Date
2008
Type
  • Conference Paper
Publication status
published
External links
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Book title
CIPS 2008. 5th International Conference on Integrated Power Electronics Systems
Journal / series
ETG-Fachbericht
Volume
111
Pages / Article No.
127 - 132
Publisher
VDE-Verlag
Event
5th International Conference on Integrated Power Electronics Systems, March 11-13, 2008
Organisational unit
03228 - Fichtner, Wolfgang  
Notes
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yes
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