3D Integration of Power Semiconductor Devices based on Surface Bump Technology
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Date
2008Type
- Conference Paper
ETH Bibliography
yes
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Publication status
publishedBook title
CIPS 2008. 5th International Conference on Integrated Power Electronics SystemsJournal / series
ETG-FachberichtVolume
Pages / Article No.
Publisher
VDE-VerlagEvent
Organisational unit
03228 - Fichtner, Wolfgang
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ETH Bibliography
yes
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