3D Integration of Power Semiconductor Devices based on Surface Bump Technology

Thumbnail
Metadata only
Author
Mermet-Guyennet, Michel
Castellazzi, Alberto
Lasserre, Philippe
Saiz, José
Show all
Date
2008
Type
  • Conference Paper
Publication status
published
External links
Full text via SFX
Book title
CIPS 2008. 5th International Conference on Integrated Power Electronics Systems
Journal / series
ETG-Fachberichte
Volume
111
Pages
127 - 132
Publisher
VDE-Verlag
Event
5th International Conference on Integrated Power Electronics Systems, March 11-13, 2008
Organisational unit
03228 - Fichtner, Wolfgang
Notes
.
More
Show all metadata
Altmetrics