A Serial Communication Infrastructure for Multi-Chip Address Event Systems
dc.contributor.author
Fasnacht, D. B.
dc.contributor.author
Whatley, A. M.
dc.contributor.author
Indiveri, G.
dc.date.accessioned
2017-06-08T21:40:09Z
dc.date.available
2017-06-08T21:40:09Z
dc.date.issued
2008
dc.identifier.isbn
978-1-424-41683-7
dc.identifier.other
10.1109/ISCAS.2008.4541501
dc.identifier.uri
http://hdl.handle.net/20.500.11850/15224
dc.language.iso
en
dc.publisher
IEEE
dc.title
A Serial Communication Infrastructure for Multi-Chip Address Event Systems
dc.type
Conference Paper
ethz.book.title
IEEE International Symposium on Circuits and Systems, 2008
ethz.pages.start
648
ethz.pages.end
651
ethz.event
IEEE International Symposium on Circuits and Systems (ISCAS 2008)
ethz.event.location
Seattle, WA, USA
ethz.event.date
May 18-21, 2008
ethz.identifier.wos
ethz.publication.place
Piscataway, NJ
ethz.publication.status
published
ethz.leitzahl
03453 - Douglas, Rodney J.
ethz.leitzahl.certified
03453 - Douglas, Rodney J.
ethz.date.deposited
2017-06-08T21:40:15Z
ethz.source
ECIT
ethz.identifier.importid
imp59364c4dc703841814
ethz.ecitpid
pub:26992
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-13T11:41:47Z
ethz.rosetta.lastUpdated
2024-02-01T15:28:24Z
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true
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Conference Paper [35889]