Microstructure-property relationship in highly ductile Au-Cu thin films for flexible electronics

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Autor(in)
Lohmiller, J.
Woo, N.C.
Spolenak, R.
Datum
2010-11-15
Typ
    Journal Article
Publikationsstatus
published
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Zeitschrift / Serie
Materials Science and Engineering: A
Band
527(29-30)
Seiten / Artikelnummer
7731 - 7740
Verlag
Elsevier
Thema
Shear bands; Thin films; Tensile test; High ductility; Nanocrystalline materials; Gold-copper alloy
Organisationseinheit
03692 - Spolenak, Ralph / Spolenak, Ralph  
Anmerkungen
Received 25 May 2010, Revised 13 August 2010, Accepted 16 August 2010, Available online 24 August 2010.
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39 Zitate in Web of Science
ETH Bibliographie
yes
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