Microstructure-property relationship in highly ductile Au-Cu thin films for flexible electronics

Thumbnail
Metadata only
Autor(in)
Lohmiller, J.
Woo, N.C.
Spolenak, R.
Datum
2010-11-15
Typ
    Journal Article
Publikationsstatus
published
Externe Links
Zeitschrift / Serie
Materials Science and Engineering: A
Band
527(29-30)
Seiten / Artikelnummer
7731 - 7740
Verlag
Elsevier
Thema
Shear bands; Thin films; Tensile test; High ductility; Nanocrystalline materials; Gold-copper alloy
Organisationseinheit
03692 - Spolenak, Ralph / Spolenak, Ralph  
Anmerkungen
Received 25 May 2010, Revised 13 August 2010, Accepted 16 August 2010, Available online 24 August 2010.
Mehr
Alle Metadaten anzeigen
Zitate
35 Zitate in Web of Science
ETH Bibliographie
yes
Altmetrics