Microstructure-property relationship in highly ductile Au-Cu thin films for flexible electronics
Metadata only
Datum
2010-11-15Typ
- Journal Article
Publikationsstatus
publishedExterne Links
Zeitschrift / Serie
Materials Science and Engineering: ABand
Seiten / Artikelnummer
Verlag
ElsevierThema
Shear bands; Thin films; Tensile test; High ductility; Nanocrystalline materials; Gold-copper alloyOrganisationseinheit
03692 - Spolenak, Ralph / Spolenak, Ralph
Anmerkungen
Received 25 May 2010, Revised 13 August 2010, Accepted 16 August 2010, Available online 24 August 2010.