Microstructure-property relationship in highly ductile Au-Cu thin films for flexible electronics
Metadata only
Date
2010-11-15Type
- Journal Article
Publication status
publishedExternal links
Journal / series
Materials Science and Engineering: AVolume
Pages / Article No.
Publisher
ElsevierSubject
Shear bands; Thin films; Tensile test; High ductility; Nanocrystalline materials; Gold-copper alloyOrganisational unit
03692 - Spolenak, Ralph / Spolenak, Ralph
Notes
Received 25 May 2010, Revised 13 August 2010, Accepted 16 August 2010, Available online 24 August 2010.More
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