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dc.contributor.author
Lohmiller, J.
dc.contributor.author
Woo, N.C.
dc.contributor.author
Spolenak, R.
dc.date.accessioned
2017-06-14T14:20:26Z
dc.date.available
2017-06-14T14:20:26Z
dc.date.issued
2010-11-15
dc.identifier.issn
0921-5093
dc.identifier.issn
1873-4936
dc.identifier.other
10.1016/j.msea.2010.08.043
dc.identifier.uri
http://hdl.handle.net/20.500.11850/158200
dc.language.iso
en
dc.publisher
Elsevier
dc.subject
Shear bands
dc.subject
Thin films
dc.subject
Tensile test
dc.subject
High ductility
dc.subject
Nanocrystalline materials
dc.subject
Gold-copper alloy
dc.title
Microstructure-property relationship in highly ductile Au-Cu thin films for flexible electronics
dc.type
Journal Article
ethz.journal.title
Materials Science and Engineering: A
ethz.journal.volume
527
ethz.journal.issue
29-30
ethz.journal.abbreviated
Mater. sci. eng., A Struct. mater.: prop. microstruct. process.
ethz.pages.start
7731
ethz.pages.end
7740
ethz.notes
Received 25 May 2010, Revised 13 August 2010, Accepted 16 August 2010, Available online 24 August 2010.
ethz.identifier.wos
ethz.identifier.nebis
000481405
ethz.publication.place
Amsterdam
ethz.publication.status
published
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02160 - Dep. Materialwissenschaft / Dep. of Materials::02645 - Institut für Metallforschung / Institute of Metals Research::03692 - Spolenak, Ralph / Spolenak, Ralph
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02160 - Dep. Materialwissenschaft / Dep. of Materials::02645 - Institut für Metallforschung / Institute of Metals Research::03692 - Spolenak, Ralph / Spolenak, Ralph
ethz.date.deposited
2017-06-14T14:20:37Z
ethz.source
ECIT
ethz.identifier.importid
imp59364d44978f895675
ethz.ecitpid
pub:42052
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-14T16:37:08Z
ethz.rosetta.lastUpdated
2018-11-05T10:44:49Z
ethz.rosetta.versionExported
true
ethz.COinS
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