Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
- Journal Article
Journal / seriesInternational Journal of Heat and Mass Transfer
Pages / Article No.
SubjectMicrochannel; Liquid cooling; Heat transfer in electronics
Organisational unit03462 - Poulikakos, Dimos
NotesReceived 17 December 2008, Accepted 9 October 2009, Available online 11 December 2009.
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