Cu Nanoparticles on TiN by Electroless Deposition: Surface-Mediated Diameter Control and Application to Si Nanowires Growth
Publication status
publishedExternal links
Journal / series
Helvetica Chimica ActaVolume
Pages / Article No.
Publisher
Wiley‐VHCASubject
Copper Nanoparticles; Electroless deposition; Galvanic Displacement; Titanium Nitride; Silicon NanowiresOrganisational unit
03872 - Copéret, Christophe / Copéret, Christophe
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