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dc.contributor.author
Maiwald, Verena
dc.contributor.author
Müller, Michelle
dc.contributor.author
Ritz, Christian
dc.contributor.author
Hierold, Christofer
dc.contributor.author
Roman, Cosmin
dc.date.accessioned
2018-01-29T10:31:28Z
dc.date.available
2017-10-19T02:08:05Z
dc.date.available
2017-10-27T14:43:57Z
dc.date.available
2018-01-29T10:31:28Z
dc.date.issued
2017
dc.identifier.issn
1057-7157
dc.identifier.issn
1941-0158
dc.identifier.other
10.1109/JMEMS.2017.2745051
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/197692
dc.identifier.doi
10.3929/ethz-b-000197692
dc.description.abstract
We present the design, fabrication, and characterization of an in-plane vibration sensor with frequency selective displacement amplification and differential capacitive read-out. The mechanical structure is based on six resonators with decreasing stiffness coupled in-plane. A differential capacitance attached to the last mass serves as electrical read out. Finite element and lumped element models are both presented. The devices were fabricated in a single mask silicon on insulator-based process. The mechanical, as well as the capacitive transfer function and the pressure dependence, have been investigated experimentally and compared with simulations. The measured mean (minimum) amplification was 24 dB (16 dB) over a bandwidth of 10 kHz (3-13 kHz). While the mean amplification is pressure dependent, the minimum amplification and bandwidth show a less than 10% decrease over a wide pressure range from 6.3 to 64 mbar. The pressure dependent measurements also show that the minimum amplification is independent of the Q factor of the modes down to values of Q~10. Both simulation and experiment show that the off-axis modes occur outside the bandwidth of the device. Along with the low cross-sensitivity of the capacitive readout (0.06%), this provides good axis selectivity despite the high number of degrees of freedom. The device can be used for detection of broadband vibration signals, e.g., for structural monitoring of infrastructure such as bridges and pipelines.
en_US
dc.format
application/pdf
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.rights.uri
http://creativecommons.org/licenses/by/3.0/
dc.subject
Mechanical amplification
en_US
dc.subject
Vibration sensor
en_US
dc.subject
coupled masses
en_US
dc.subject
axis selectivity
en_US
dc.subject
band-pass
en_US
dc.subject
multi-degree of freedom
en_US
dc.subject
mechanical filter
en_US
dc.subject
damping
en_US
dc.subject
mass-spring network
en_US
dc.title
Off-Resonant Vibration Amplifier With Flattened Band-Pass Characteristic and Improved Axis Selectivity
en_US
dc.type
Journal Article
dc.rights.license
Creative Commons Attribution 3.0 Unported
dc.date.published
2017-09-12
ethz.journal.title
Journal of Microelectromechanical Systems
ethz.journal.volume
26
en_US
ethz.journal.issue
6
en_US
ethz.pages.start
1345
en_US
ethz.pages.end
1355
en_US
ethz.version.deposit
publishedVersion
en_US
ethz.identifier.wos
ethz.identifier.scopus
ethz.publication.place
New York, NY
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02130 - Dep. Maschinenbau und Verfahrenstechnik / Dep. of Mechanical and Process Eng.::03609 - Hierold, Christofer / Hierold, Christofer
en_US
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02130 - Dep. Maschinenbau und Verfahrenstechnik / Dep. of Mechanical and Process Eng.::03609 - Hierold, Christofer / Hierold, Christofer
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02130 - Dep. Maschinenbau und Verfahrenstechnik / Dep. of Mechanical and Process Eng.::03609 - Hierold, Christofer / Hierold, Christofer
ethz.date.deposited
2017-10-19T02:08:06Z
ethz.source
SCOPUS
ethz.eth
yes
en_US
ethz.availability
Open access
en_US
ethz.rosetta.installDate
2018-01-29T10:31:35Z
ethz.rosetta.lastUpdated
2022-03-28T19:01:53Z
ethz.rosetta.versionExported
true
ethz.COinS
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