Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates
A Synchrotron-Based Technique for In Situ Characterization
Metadata only
Date
2009Type
- Conference Paper
Publication status
publishedExternal links
Editor
Book title
Stress-induced phenomena in metallization : tenth International Workshop on Stress-Induced Phenomena in Metallization : Austin, Texas, 5-7 November 2008Journal / series
AIP Conference ProceedingsVolume
Pages / Article No.
Publisher
American Institute of PhysicsEvent
Subject
Fracture; Buckling; Adhesion; Thin films; Synchrotron radiation; Diffusion barrier; Tantalum; CopperMore
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