Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates

A Synchrotron-Based Technique for In Situ Characterization
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Author
Frank, Stephan
Handge, Ulrich A.
Olliges, Sven
Spolenak, Ralph
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Date
2009
Type
  • Conference Paper
Publication status
published
External links
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Editor
Ho, Paul S.
Ogawa, Shinichi
Zschech, Ehrenfried
Book title
Stress-induced phenomena in metallization : tenth International Workshop on Stress-Induced Phenomena in Metallization : Austin, Texas, 5-7 November 2008
Journal / series
AIP conference proceedings
Volume
1143
Pages / Article No.
104 - 117
Publisher
American Institute of Physics
Event
Tenth International Workshop on Stress-Induced Phenomena in Metallization 2008, Austin, Texas, USA, November 5-7, 2008
Subject
Fracture; Buckling; Adhesion; Thin films; Synchrotron radiation; Diffusion barrier; Tantalum; Copper
Notes
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yes
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