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dc.contributor.author
Frank, Stephan
dc.contributor.author
Handge, Ulrich A.
dc.contributor.author
Olliges, Sven
dc.contributor.author
Spolenak, Ralph
dc.contributor.editor
Ho, Paul S.
dc.contributor.editor
Ogawa, Shinichi
dc.contributor.editor
Zschech, Ehrenfried
dc.date.accessioned
2017-06-08T23:47:14Z
dc.date.available
2017-06-08T23:47:14Z
dc.date.issued
2009
dc.identifier.isbn
0-7354-0680-4
dc.identifier.isbn
978-0-7354-0680-3
dc.identifier.issn
0094-243X
dc.identifier.issn
1551-7616
dc.identifier.other
10.1063/1.3169250
dc.identifier.uri
http://hdl.handle.net/20.500.11850/20089
dc.language.iso
en
dc.publisher
American Institute of Physics
dc.subject
Fracture
dc.subject
Buckling
dc.subject
Adhesion
dc.subject
Thin films
dc.subject
Synchrotron radiation
dc.subject
Diffusion barrier
dc.subject
Tantalum
dc.subject
Copper
dc.title
Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates
dc.type
Conference Paper
ethz.title.subtitle
A Synchrotron-Based Technique for In Situ Characterization
ethz.book.title
Stress-induced phenomena in metallization : tenth International Workshop on Stress-Induced Phenomena in Metallization : Austin, Texas, 5-7 November 2008
ethz.journal.title
AIP Conference Proceedings
ethz.journal.volume
1143
ethz.journal.abbreviated
AIP Conf. Proc.
ethz.pages.start
104
ethz.pages.end
117
ethz.event
Tenth International Workshop on Stress-Induced Phenomena in Metallization 2008
ethz.event.location
Austin, Texas, USA
ethz.event.date
November 5-7, 2008
ethz.identifier.wos
ethz.identifier.nebis
005887039
ethz.publication.place
Melville, N.Y.
ethz.publication.status
published
ethz.date.deposited
2017-06-08T23:47:17Z
ethz.source
ECIT
ethz.identifier.importid
imp59364cb20715868924
ethz.ecitpid
pub:32524
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-12T20:09:50Z
ethz.rosetta.lastUpdated
2020-02-14T06:33:46Z
ethz.rosetta.exportRequired
true
ethz.rosetta.versionExported
true
ethz.COinS
ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.atitle=Mechanical%20Failure%20of%20Thin%20Ta%20and%20Cu/Ta%20Layers%20on%20Polyimide%20Substrates&rft.jtitle=AIP%20Conference%20Proceedings&rft.date=2009&rft.volume=1143&rft.spage=104&rft.epage=117&rft.issn=0094-243X&1551-7616&rft.au=Frank,%20Stephan&Handge,%20Ulrich%20A.&Olliges,%20Sven&Spolenak,%20Ralph&rft.isbn=0-7354-0680-4&978-0-7354-0680-3&rft.genre=proceeding&rft_id=info:doi/10.1063/1.3169250&rft.btitle=Stress-induced%20phenomena%20in%20metallization%20:%20tenth%20International%20Workshop%20on%20Stress-Induced%20Phenomena%20in%20Metallization%20:%20Austin,%20Texas,%205-
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