Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
- Journal Article
Journal / seriesTransactions of the ASME. Ser. C. Journal of heat transfer
PublisherAmerican Society of Mechanical Engineers
Subjectmanifold; microchannels; impinging jet; heat transfer; electronics cooling
Organisational unit03462 - Poulikakos, Dimos
NotesManuscript received May 27 2009, Final manuscript received January 28 2010, Published online June 2 2010.
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