Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips - Research Collection

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Author

Brunschwiler, T.

Date

2010-08

Type

Journal Article

Citations

Cited 70 times in Web of Science

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1115/1.4001306

Journal / series

Transactions of the ASME. Ser. C. Journal of heat transfer

Volume

132(8)

Pages / Article No.

081402

Publisher

American Society of Mechanical Engineers

Subject

manifold; microchannels; impinging jet; heat transfer; electronics cooling

Organisational unit

03462 - Poulikakos, Dimos / Poulikakos, Dimos

Notes

Manuscript received May 27 2009, Final manuscript received January 28 2010, Published online June 2 2010.

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Show all metadata

Citations

Cited 70 times in Web of Science

ETH Bibliography

yes

Altmetrics