Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
Metadata only
Date
2010-08Type
- Journal Article
Publication status
publishedExternal links
Journal / series
Journal of Heat TransferVolume
Pages / Article No.
Publisher
American Society of Mechanical EngineersSubject
manifold; microchannels; impinging jet; heat transfer; electronics coolingOrganisational unit
03462 - Poulikakos, Dimos / Poulikakos, Dimos
Notes
Manuscript received May 27 2009, Final manuscript received January 28 2010, Published online June 2 2010.More
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