Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

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Author
Escher, W.
Brunschwiler, T.
Michel, B.
Poulikakos, D.
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Date
2010-08
Type
  • Journal Article
Publication status
published
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Journal / series
Transactions of the ASME. Ser. C. Journal of heat transfer
Volume
132(8)
Pages
081402
Publisher
American Society of Mechanical Engineers
Subject
manifold; microchannels; impinging jet; heat transfer; electronics cooling
Organisational unit
03462 - Poulikakos, Dimos
Notes
Manuscript received May 27 2009, Final manuscript received January 28 2010, Published online June 2 2010.
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Citations
Cited 18 times in Web of Science
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