Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding - Research Collection

Metadata only

Author

Natzke, Philipp

Grossner, Ulrike

Janczak-Rusch, Jolanta

Date

2017-12-11

Type

Conference Paper

Citations

Cited 1 times in Web of Science

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1109/WiPDA.2017.8170541

Book title

2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)

Pages / Article No.

165 - 170

Publisher

IEEE

Event

5th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2017), Albuquerque, NM, USA, October 30-November 1, 2017

Subject

packaging; die attach; TLP bonding; Ag-Sn

Organisational unit

09480 - Grossner, Ulrike / Grossner, Ulrike

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Citations

Cited 1 times in Web of Science

ETH Bibliography

yes

Altmetrics