Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding

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Author
Natzke, Philipp
Grossner, Ulrike
Janczak-Rusch, Jolanta
Jeurgens, Lars
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Date
2017-12-11
Type
  • Conference Paper
Publication status
published
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Book title
2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)
Pages
165 - 170
Publisher
IEEE
Event
5th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA 2017), Albuquerque, NM, USA, October 30-November 1, 2017
Subject
packaging; die attach; TLP bonding; Ag-Sn
Organisational unit
09480 - Grossner, Ulrike
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