Thin layer Ag-Sn transient liquid phase bonding using magnetron sputtering for chip to baseplate bonding

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Date
2017Type
- Conference Paper
Abstract
The formation of a high temperature die attach based on transient liquid phase (TLP) bonding is demonstrated using the binary system Ag-Sn in a sputtered thin layer approach. The microstructure and shear strength are compared to a foil based approach and show the successful replacement of the Sn foil and thus a simplification of the stack assembly. The diffusion of the Ag-Sn system is investigated in a long-term experiment at room temperature as well as in short-term experiments in the temperature range of the tin melting point. The results show the bondability of long-term stored samples and the possibility for decreased layer thickness while still enabling formation of the liquid phase to create the bond. TLP joints with a tin thickness of 2 μm are manufactured successfully and show comparable microstructures to thick layer joints. This approach offers an improved manufacturability of power modules. Show more
Permanent link
https://doi.org/10.3929/ethz-b-000225260Publication status
publishedExternal links
Book title
2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA)Pages / Article No.
Publisher
IEEEEvent
Subject
packaging; die attach; TLP bonding; Ag-SnOrganisational unit
09480 - Grossner, Ulrike / Grossner, Ulrike
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