Reliability investigation of the copper-zinc system for solid diffusion bonding in power modules - Research Collection

Metadata only

Author

Date

2017-09

Type

Journal Article

Citations

Cited 4 times in Web of Science

Cited 3 times in Scopus

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1016/j.microrel.2017.07.023

Journal / series

Microelectronics Reliability

Volume

76-77

Pages / Article No.

460 - 464

Publisher

Elsevier

Subject

Solid diffusion bonding; Copper-zinc; Power device assembly; Thermal aging; Reliability

Organisational unit

03380 - Huang, Qiuting (emeritus) / Huang, Qiuting (emeritus)

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Show all metadata

Citations

Cited 4 times in Web of Science

Cited 3 times in Scopus

ETH Bibliography

yes

Altmetrics