Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction

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Author
Budiman, A.S.
Nix, W.D.
Tamura, N.
Valek, B.C.
Gadre, K.
Maiz, J.
Spolenak, R.
Patel, J.R.
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Date
2006-06
Type
    Journal Article
Publication status
published
External links
Journal / series
Applied Physics Letters
Volume
88(23)
Pages / Article No.
233515
Publisher
American Institute of Physics
Subject
Copper; X-ray diffraction; Voids (solid); Plasticity; Bending; Dislocations; Plastic flow; Point defects; Integrated circuit interconnections
Organisational unit
03692 - Spolenak, Ralph / Spolenak, Ralph  
Notes
Received 1 February 2006, Accepted 10 May 2006, Published online 9 June 2006.
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