Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
dc.contributor.author
Budiman, A.S.
dc.contributor.author
Nix, W.D.
dc.contributor.author
Tamura, N.
dc.contributor.author
Valek, B.C.
dc.contributor.author
Gadre, K.
dc.contributor.author
Maiz, J.
dc.contributor.author
Spolenak, R.
dc.contributor.author
Patel, J.R.
dc.date.accessioned
2017-06-09T06:12:50Z
dc.date.available
2017-06-09T06:12:50Z
dc.date.issued
2006-06
dc.identifier.issn
0003-6951
dc.identifier.issn
1077-3118
dc.identifier.other
10.1063/1.2210451
dc.identifier.uri
http://hdl.handle.net/20.500.11850/24195
dc.language.iso
en
dc.publisher
American Institute of Physics
dc.subject
Copper
dc.subject
X-ray diffraction
dc.subject
Voids (solid)
dc.subject
Plasticity
dc.subject
Bending
dc.subject
Dislocations
dc.subject
Plastic flow
dc.subject
Point defects
dc.subject
Integrated circuit interconnections
dc.title
Crystal plasticity in Cu damascene interconnect lines undergoing electromigration as revealed by synchrotron x-ray microdiffraction
dc.type
Journal Article
ethz.journal.title
Applied Physics Letters
ethz.journal.volume
88
ethz.journal.issue
23
ethz.journal.abbreviated
Appl. Phys. Lett.
ethz.pages.start
233515
ethz.size
3 p.
ethz.notes
Received 1 February 2006, Accepted 10 May 2006, Published online 9 June 2006.
ethz.identifier.wos
ethz.identifier.nebis
000038985
ethz.publication.place
Melville, NY
ethz.publication.status
published
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02160 - Dep. Materialwissenschaft / Dep. of Materials::02645 - Institut für Metallforschung / Institute of Metals Research::03692 - Spolenak, Ralph / Spolenak, Ralph
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02160 - Dep. Materialwissenschaft / Dep. of Materials::02645 - Institut für Metallforschung / Institute of Metals Research::03692 - Spolenak, Ralph / Spolenak, Ralph
ethz.date.deposited
2017-06-09T06:12:57Z
ethz.source
ECIT
ethz.identifier.importid
imp59364d21d667492133
ethz.ecitpid
pub:39504
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-14T14:49:52Z
ethz.rosetta.lastUpdated
2024-02-01T16:20:20Z
ethz.rosetta.versionExported
true
ethz.COinS
ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.atitle=Crystal%20plasticity%20in%20Cu%20damascene%20interconnect%20lines%20undergoing%20electromigration%20as%20revealed%20by%20synchrotron%20x-ray%20microdiffraction&rft.jtitle=Applied%20Physics%20Letters&rft.date=2006-06&rft.volume=88&rft.issue=23&rft.spage=233515&rft.issn=0003-6951&1077-3118&rft.au=Budiman,%20A.S.&Nix,%20W.D.&Tamura,%20N.&Valek,%20B.C.&Gadre,%20K.&rft.genre=article&rft_id=info:doi/10.1063/1.2210451&
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