Electromigration-induced plastic deformation in Cu damascene interconnect lines as revealed by Synchrotron X-Ray Microdiffraction
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Date
2006Type
- Conference Paper
ETH Bibliography
yes
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Publication status
publishedEditor
Book title
Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.Journal / series
Materials Research Society Symposium ProceedingsVolume
Pages / Article No.
Publisher
Materials Research SocietyEvent
Organisational unit
03692 - Spolenak, Ralph / Spolenak, Ralph
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ETH Bibliography
yes
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