Laser Sintering of Dip-Based All-Copper Interconnects

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Author
Del Carro, Luca
Kossatz, Martin
Schnackenberg, Lucas
Fettke, Matthias
Clark, Ian M.
Brunschwiler, Thomascc
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Date
2018
Type
    Conference Paper
Publication status
published
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Book title
Proceedings - The 2018 68th Electronic Components and Technology Conference
Pages / Article No.
279 - 286
Publisher
IEEE
Event
68th IEEE Electronic Components and Technology Conference (ECTC 2018), San Diego, CA, May 29 - June 1, 2018
Subject
advanced flip-chip packaging; flip-chip electrical interconnects; all-copper interconnects; dip-based all-copper interconnects; laser sintering; copper nano-and microparticles; transient thermal finite element model
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Citations
Cited 2 times in Scopus
ETH Bibliography
yes
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