Sub-mW multi-Gbps chip-to-chip communication Links for Ultra-Low Power IoT end-nodes
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Date
2018Type
- Conference Paper
Publication status
publishedExternal links
Book title
2018 IEEE International Symposium on Circuits and Systems (ISCAS)Pages / Article No.
Publisher
IEEEEvent
Subject
low-swing serial link; energy efficiency; internet of things; near sensor processingOrganisational unit
03996 - Benini, Luca / Benini, Luca
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