Scaling Optical Interconnects Beyond 400 Gb/s

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Author
Bakopoulos, Paraskevas
Ma, Pingcc
Tsiokos, Dimitris
Hettrich, Horst
Eltes, Felix
Uhl, Christopher
Lischke, Stefan
Petousi, Despoina
Abel, Stefan
Schmid, Robert
Dabos, George
Kalavrouziotis, Dimitrios
Manolis, Amanda
Rubenstein, Aynat
Moor, Dominik
Zimmermann, Lars
Pleros, Nikos
Möller, Michael
Fompeyrine, Jean
Leuthold, Juergcc
Mentovich, Elad
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Date
2018-09
Type
  • Conference Paper
Publication status
published
External links
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Book title
2018 European Conference on Optical Communication (ECOC)
Pages / Article No.
8535463
Publisher
IEEE
Event
44th European Conference on Optical Communication (ECOC 2018), Rome, Italy, September 23-27, 2018
Organisational unit
03974 - Leuthold, Juerg / Leuthold, Juerg  
02635 - Institut für Elektromagnetische Felder / Electromagnetic Fields Laboratory
Funding
780997 - Wafer-scale, CMOS integration of photonics, plasmonics and electronics for mass manufacturing 200Gb/s NRZ transceivers towards low-cost Terabit connectivity in Data Centers (EC)
688166 - A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices (SBFI)
159565 - Plasmonic Active Devices based on Metal Oxides (SNF)
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