New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions

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Author
Barlini, D.
Ciappa, M.
Castellazzi, A.
Mermet-Guyennet, M.
Fichtner, W.
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Date
2006
Type
  • Conference Paper
Publication status
published
External links
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Journal / series
Microelectronics Reliability
Volume
46(9-11)
Pages / Article No.
1772 - 1777
Publisher
Elsevier
Event
17th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, Wuppertal, Germany, October 3-6, 2006
Organisational unit
03228 - Fichtner, Wolfgang  
Notes
Available online 23 August 2006.
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Citations
Cited 36 times in Web of Science
ETH Bibliography
yes
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