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dc.contributor.author
Del Carro, Luca
dc.contributor.author
Zinn, Alfred A.
dc.contributor.author
Ruch, Patrick
dc.contributor.author
Bouville, Florian
dc.contributor.author
Studart, André R.
dc.contributor.author
Brunschwiler, Thomas
dc.date.accessioned
2019-09-16T10:40:25Z
dc.date.available
2019-09-15T02:35:32Z
dc.date.available
2019-09-16T10:40:25Z
dc.date.issued
2019-10
dc.identifier.other
10.1007/s11664-019-07452-8
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/364116
dc.language.iso
en
en_US
dc.publisher
Springer
en_US
dc.subject
Sintering
en_US
dc.subject
copper nanoparticles
en_US
dc.subject
copper paste
en_US
dc.subject
die attachment
en_US
dc.subject
power electronic packaging
en_US
dc.subject
power electronics
en_US
dc.title
Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
en_US
dc.type
Journal Article
dc.date.published
2019-07-29
ethz.journal.title
Journal of Electronic Materials
ethz.journal.volume
48
en_US
ethz.journal.issue
10
en_US
ethz.pages.start
6823
en_US
ethz.pages.end
6834
en_US
ethz.identifier.wos
ethz.identifier.scopus
ethz.publication.place
Berlin
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02160 - Dep. Materialwissenschaft / Dep. of Materials::03831 - Studart, André R. / Studart, André R.
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02160 - Dep. Materialwissenschaft / Dep. of Materials::03831 - Studart, André R. / Studart, André R.
ethz.date.deposited
2019-09-15T02:35:36Z
ethz.source
SCOPUS
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2019-09-16T10:40:40Z
ethz.rosetta.lastUpdated
2020-02-15T21:37:56Z
ethz.rosetta.versionExported
true
ethz.COinS
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