Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias

Thumbnail
Metadata only
Author
Kühne, Stéphane
Hierold, Christofer
Date
2011-08
Type
  • Journal Article
Publication status
published
External links
Search via SFX
Journal / series
Journal of Micromechanics and Microengineering
Volume
21(8)
Pages / Article No.
085032
Publisher
Institute of Physics
Organisational unit
03609 - Hierold, Christofer  
Notes
Received 14 March 2011, In final form 13 May 2011, Published 19 July 2011.
More
Show all metadata
Citations
Cited 15 times in Web of Science
ETH Bibliography
yes
Altmetrics