Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias - Research Collection

Metadata only

Author

Kühne, Stéphane

Hierold, Christofer

Date

2011-08

Type

Journal Article

Citations

Cited 21 times in Web of Science

ETH Bibliography

yes

Altmetrics

Publication status

published

External links

https://doi.org/10.1088/0960-1317/21/8/085032

Journal / series

Journal of Micromechanics and Microengineering

Volume

21(8)

Pages / Article No.

085032

Publisher

Institute of Physics

Organisational unit

03609 - Hierold, Christofer / Hierold, Christofer

Notes

Received 14 March 2011, In final form 13 May 2011, Published 19 July 2011.

More

Show all metadata

Citations

Cited 21 times in Web of Science

ETH Bibliography

yes

Altmetrics