Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias
Metadata only
Date
2011-08Type
- Journal Article
Publication status
publishedExternal links
Journal / series
Journal of Micromechanics and MicroengineeringVolume
Pages / Article No.
Publisher
Institute of PhysicsOrganisational unit
03609 - Hierold, Christofer / Hierold, Christofer
Notes
Received 14 March 2011, In final form 13 May 2011, Published 19 July 2011.More
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