Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias - Research Collection

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Author

Kühne, Stéphane

Hierold, Christofer

Date

2011-08

Type

Journal Article

Citations

Cited 15 times in Web of Science

Cited 21 times in Scopus

ETH Bibliography

yes

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Publication status

published

External links

https://doi.org/10.1088/0960-1317/21/8/085032

Journal / series

Journal of Micromechanics and Microengineering

Volume

21(8)

Pages / Article No.

085032

Publisher

Institute of Physics

Organisational unit

03609 - Hierold, Christofer

Notes

Received 14 March 2011, In final form 13 May 2011, Published 19 July 2011.

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Citations

Cited 15 times in Web of Science

Cited 21 times in Scopus

ETH Bibliography

yes

Altmetrics