Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias
- Journal Article
Journal / seriesJournal of Micromechanics and Microengineering
PublisherInstitute of Physics
Organisational unit03609 - Hierold, Christofer
NotesReceived 14 March 2011, In final form 13 May 2011, Published 19 July 2011.
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