Wafer-level packaging and direct interconnection technology based on hybrid bonding and through silicon vias

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Author
Kühne, Stéphane
Hierold, Christofer
Date
2011-08
Type
  • Journal Article
Publication status
published
External links
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Journal / series
Journal of Micromechanics and Microengineering
Volume
21(8)
Pages
085032
Publisher
Institute of Physics
Organisational unit
03609 - Hierold, Christofer
Notes
Received 14 March 2011, In final form 13 May 2011, Published 19 July 2011.
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Citations
Cited 15 times in Web of Science
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