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dc.contributor.author
Scheffler, Michael
dc.contributor.author
Franzon, Paul D.
dc.contributor.author
Tröster, Gerhard
dc.date.accessioned
2017-06-09T19:09:33Z
dc.date.available
2017-06-09T19:09:33Z
dc.date.issued
2004-01
dc.identifier.issn
1521-334X
dc.identifier.issn
1523-334X
dc.identifier.issn
1558-0822
dc.identifier.other
10.1109/TEPM.2004.830513
dc.identifier.uri
http://hdl.handle.net/20.500.11850/46085
dc.language.iso
en
dc.publisher
IEEE
dc.subject
Cost quality tradeoff
dc.subject
Genetic algorithm
dc.subject
High-density packaging (HDP)
dc.subject
Pareto chart
dc.title
A “Defect Level Versus Cost” System Tradeoff for Electronics Manufacturing
dc.type
Journal Article
ethz.journal.title
IEEE Transactions on Electronics Packaging Manufacturing
ethz.journal.volume
27
ethz.journal.issue
1
ethz.journal.abbreviated
IEEE trans. electron. packag. manuf.
ethz.pages.start
67
ethz.pages.end
76
ethz.notes
Manuscript received 26 November 2002, Date of current version 3 September 2004.
ethz.identifier.wos
ethz.identifier.nebis
002051537
ethz.publication.place
New York
ethz.publication.status
published
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02634 - Institut für Elektronik / Institute for Electronics::03388 - Tröster, Gerhard (emeritus)
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::02634 - Institut für Elektronik / Institute for Electronics::03388 - Tröster, Gerhard (emeritus)
ethz.date.deposited
2017-06-09T19:10:10Z
ethz.source
ECIT
ethz.identifier.importid
imp59364ef54dec194373
ethz.ecitpid
pub:75694
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-12T18:13:50Z
ethz.rosetta.lastUpdated
2018-10-01T16:07:27Z
ethz.rosetta.exportRequired
true
ethz.rosetta.versionExported
true
ethz.COinS
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