Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform
Abstract
We present a plasmonic platform featuring efficient, broadband metallic fiber-to-chip couplers that directly interface plasmonic slot waveguides, such as compact and high-speed electro-optic modulators. The metallic gratings exhibit an experimental fiber-to-slot coupling efficiency of −2.7 dB with −1.4 dB in simulations with the same coupling principle. Further, they offer a huge spectral window with a 3 dB passband of 350 nm. The technology relies on a vertically arranged layer stack, metal–insulator–metal waveguides, and fiber-to-slot couplers and is formed in only one lithography step with a minimum feature size of 250 nm. As an application example, we fabricate new modulator devices with an electro-optic organic material in the slot waveguide and reach 50 and 100 Gbit/s data modulation in the O- and C-bands within the same device. The devices’ broad spectral bandwidth and their relaxed fabrication may render them suitable for experiments and applications in the scope of sensing, nonlinear optics, or telecommunications. Show more
Permanent link
https://doi.org/10.3929/ethz-b-000493455Publication status
publishedExternal links
Journal / series
Nano LettersVolume
Pages / Article No.
Publisher
American Chemical SocietySubject
Plasmonics; Slot waveguides; Grating; Fiber-to-chip coupling; Extraordinary optical transmission; Electro-optic modulatorsOrganisational unit
03974 - Leuthold, Juerg / Leuthold, Juerg
02635 - Institut für Elektromagnetische Felder / Electromagnetic Fields Laboratory
Funding
670478 - Plasmonic-Silicon-Organic Hybrid – a Universal Platform for THz Communications (EC)
780997 - Wafer-scale, CMOS integration of photonics, plasmonics and electronics for mass manufacturing 200Gb/s NRZ transceivers towards low-cost Terabit connectivity in Data Centers (EC)
871391 - Energy- and Size-efficient Ultra-fast Plasmonic Circuits for Neuromorphic Computing Architectures (EC)
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