Transient Stability Analysis of Discrete and Multi-chip Power Semiconductor Packages
- Conference Paper
This paper presents a novel approach of analyzing the stability of power systems during switching transients, simultaneously taking into account the circuit/package/chip design parasitics and the dynamic I-V and C-V device characteristics. The suggested method is highly beneficial for reliable virtual prototyping and hence, full utilization of highly efficient power semiconductor devices. © 2021 IEEE Show more
Book title2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD)
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