10Gb/s Intra-Chip Compact Electro-Optical Interconnect
Open access
Date
2021-06Type
- Conference Paper
Abstract
We demonstrate a digital-to-optical-to-digital link operating at 10 Gb/s with 2.4 pJ/b below 10-9 BER enabled by zero-change CMOS macros. All necessary electronic-photonic circuits are contained within 0.015 mm2 of silicon area.
Permanent link
https://doi.org/10.3929/ethz-b-000500976Publication status
publishedBook title
Optical Fiber Communication Conference (OFC) 2021Journal / series
OSA Technical DigestPages / Article No.
Publisher
OSA PublishingEvent
Organisational unit
02635 - Institut für Elektromagnetische Felder / Electromagnetic Fields Laboratory03974 - Leuthold, Juerg / Leuthold, Juerg
Funding
780997 - Wafer-scale, CMOS integration of photonics, plasmonics and electronics for mass manufacturing 200Gb/s NRZ transceivers towards low-cost Terabit connectivity in Data Centers (EC)
Notes
Conference lecture held on June 11, 2021More
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