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dc.contributor.author
Drofenik, Uwe
dc.contributor.author
Cottet, Didier
dc.contributor.author
Müsing, Andreas
dc.contributor.author
Meyer, Jean-Marc
dc.contributor.author
Kolar, Johann W.
dc.date.accessioned
2021-07-30T13:18:51Z
dc.date.available
2017-06-08T16:57:13Z
dc.date.available
2021-07-30T13:18:51Z
dc.date.issued
2007
dc.identifier.isbn
1-4244-0844-X
en_US
dc.identifier.isbn
1-4244-0843-1
en_US
dc.identifier.other
10.1109/PCCON.2007.373020
en_US
dc.identifier.uri
http://hdl.handle.net/20.500.11850/5268
dc.description.abstract
For analyzing reliability or short-term overload conditions of power electronic systems, it is necessary to know transient temperatures of the power semiconductors. Directly coupling thermal and circuit simulators increases the simulation time by orders of magnitude, therefore making such an approach impractical. A well-known solution to this problem is to extract thermal equivalent circuits from 3D-field simulations and to insert them directly into the circuit simulator. In this paper we discuss the poor scaling performance of this state-of-the-art approach. There is an enormous increase in simulation time if there are more than just a few chips thermally modeled. We propose a general procedure at the circuit simulator solver level to increase the calculation speed of such a coupled simulation significantly.
en_US
dc.language.iso
en
en_US
dc.publisher
IEEE
en_US
dc.subject
Electric-thermal simulation
en_US
dc.subject
Increasing simulation speed
en_US
dc.subject
Thermal coupling
en_US
dc.title
Computationally Efficient Integration of Complex Thermal Multi-Chip Power Module Models into Circuit Simulators
en_US
dc.type
Conference Paper
dc.date.published
2007-11-18
ethz.book.title
2007 Power Conversion Conference Proceedings
en_US
ethz.pages.start
550
en_US
ethz.pages.end
557
en_US
ethz.event
4th Power Conversion Conference (PCC'07)
en_US
ethz.event.location
Nagoya, Japan
en_US
ethz.event.date
April 2-5, 2007
en_US
ethz.identifier.wos
ethz.publication.place
Piscataway, NJ
en_US
ethz.publication.status
published
en_US
ethz.leitzahl
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::03573 - Kolar, Johann W. / Kolar, Johann W.
en_US
ethz.leitzahl.certified
ETH Zürich::00002 - ETH Zürich::00012 - Lehre und Forschung::00007 - Departemente::02140 - Dep. Inf.technologie und Elektrotechnik / Dep. of Inform.Technol. Electrical Eng.::03573 - Kolar, Johann W. / Kolar, Johann W.
ethz.date.deposited
2017-06-08T16:57:46Z
ethz.source
ECIT
ethz.identifier.importid
imp59364b8a368cc76200
ethz.ecitpid
pub:15528
ethz.eth
yes
en_US
ethz.availability
Metadata only
en_US
ethz.rosetta.installDate
2017-07-17T09:07:18Z
ethz.rosetta.lastUpdated
2022-03-29T10:50:36Z
ethz.rosetta.versionExported
true
ethz.COinS
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