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dc.contributor.author
Ciappa, M.
dc.contributor.author
Carbognani, F.
dc.contributor.author
Fichtner, W.
dc.date.accessioned
2017-06-10T07:44:37Z
dc.date.available
2017-06-10T07:44:37Z
dc.date.issued
2003
dc.identifier.isbn
0-7803-7876-8
dc.identifier.other
10.1109/ISPSD.2003.1225286
dc.identifier.uri
http://hdl.handle.net/20.500.11850/54113
dc.language.iso
en
dc.publisher
IEEE Service Center
dc.title
Lifetime modeling of thermomechanics-related failure mechanisms in high power IGBT modules for traction applications
dc.type
Conference Paper
ethz.book.title
2003 IEEE 15th International Symposium on Power Semiconductor Devices and ICs proceedings
ethz.pages.start
295
ethz.pages.end
298
ethz.event
15th International Symposium on Power Semiconductor Devices and Integrated Circuits
ethz.event.location
Cambridge, England
ethz.event.date
April 14-17, 2003
ethz.identifier.wos
ethz.identifier.nebis
004587597
ethz.publication.place
Piscataway, NJ
ethz.publication.status
published
ethz.date.deposited
2017-06-10T07:47:21Z
ethz.source
ECIT
ethz.identifier.importid
imp59364fa2bdabe99246
ethz.ecitpid
pub:87439
ethz.eth
yes
ethz.availability
Metadata only
ethz.rosetta.installDate
2017-07-12T20:34:11Z
ethz.rosetta.lastUpdated
2017-07-12T20:34:11Z
ethz.rosetta.versionExported
true
ethz.COinS
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